MAX MCR Electronic Grade Epoxy Potting Compound for Printed Circuit Boards, Electronic Encapsulation, Waterproofing, Permanent Circuit Masking, None Conductive Epoxy Resin, DC/AC Up to 500 Volts
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Electronic Potting and Encapsulating Compound For Printed Circuit Board -Insulate AC/DC High And Low VoltageBonds to ABS PVC Plastic Housing, Wire Jackets, Mold Injected Components, Powder Coated And Metal SubstratesNone Electrically Conductive Epoxy Resin For Waterproofing And Embedding Electronic ComponentsOpaque Black For Permanent Masking, Room Temperature Curing, 2:1 Mix Ratio, Medium SettingLow Viscosity, Self Leveling, Medium Set Time, Cures Very Rigid, Up To 190°F (90°C) Operating Temperature
Electronic Potting and Encapsulating Compound For Printed Circuit Board -Insulate AC/DC High And Low VoltageBonds to ABS PVC Plastic Housing, Wire Jackets, Mold Injected Components, Powder Coated And Metal SubstratesNone Electrically Conductive Epoxy Resin For Waterproofing And Embedding Electronic ComponentsOpaque Black For Permanent Masking, Room Temperature Curing, 2:1 Mix Ratio, Medium SettingLow Viscosity, Self Leveling, Medium Set Time, Cures Very Rigid, Up To 190°F (90°C) Operating Temperature
2020-08-23 09:03:52