GENNEL 10gram Thermal Conductive Glue , Silicone Thermal Plaster Viscous Adhesive Compound For LED GPU MOSFET Chipset Heatsink Cooling
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상품특징
Make sure this fits by entering your model number.Suitable for all heatsink without fixed clip. It has heat conducting properties, strong adhesion. Helps disperse the heat from Chipset to heatsink effectively.Use for MOSFET, LED, heat sinks , North-south bridge, video card, Chipset, heat dissipation part, heat dissipation, electrical appliances, instruments and other industries.It has good thermal conductivity and wide service temperature range(-60~250 degrees Celsius)Thermal conductivity:> 1.2W/m-K, Do not use thermal glue "between CPU and HEATSINK"!Package Includes : 1 x GENNEL G109 10g thermal glue
상품설명
* 100% New Heatsink plaster. * Use for MOSFET, LED, heat sinks , North-south bridge, video card, Chipset, heat dissipation part, heat dissipation, electrical appliances, instruments and other industries. * Features: thermal properties, strong adhesion * Melting capacity: 0 (250 ℃ / 24Hours) * Evaporation: 0.001% (250 ℃ / 24Hours) * Thermal conductivity:> 1.2W/m-K * Thermal Impedance: <0.06 * Clotting time: 3min (25 ℃) * Adhesion and tensile strength(MPa): 2.1 * Insulation coefficient> 5.1 * Dissipation coefficient <0.005 * Temperature resistance: -60 ~ 250 ℃ * Net Weight: 10g Do not use thermal glue between CPU and HEATSINK Package Includes: 1 x GENNEL G109 10g Thermal Plaster Glue.
Make sure this fits by entering your model number.Suitable for all heatsink without fixed clip. It has heat conducting properties, strong adhesion. Helps disperse the heat from Chipset to heatsink effectively.Use for MOSFET, LED, heat sinks , North-south bridge, video card, Chipset, heat dissipation part, heat dissipation, electrical appliances, instruments and other industries.It has good thermal conductivity and wide service temperature range(-60~250 degrees Celsius)Thermal conductivity:> 1.2W/m-K, Do not use thermal glue "between CPU and HEATSINK"!Package Includes : 1 x GENNEL G109 10g thermal glue
상품설명
* 100% New Heatsink plaster. * Use for MOSFET, LED, heat sinks , North-south bridge, video card, Chipset, heat dissipation part, heat dissipation, electrical appliances, instruments and other industries. * Features: thermal properties, strong adhesion * Melting capacity: 0 (250 ℃ / 24Hours) * Evaporation: 0.001% (250 ℃ / 24Hours) * Thermal conductivity:> 1.2W/m-K * Thermal Impedance: <0.06 * Clotting time: 3min (25 ℃) * Adhesion and tensile strength(MPa): 2.1 * Insulation coefficient> 5.1 * Dissipation coefficient <0.005 * Temperature resistance: -60 ~ 250 ℃ * Net Weight: 10g Do not use thermal glue between CPU and HEATSINK Package Includes: 1 x GENNEL G109 10g Thermal Plaster Glue.
2021-01-08 16:19:12