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사진확대

TVSS; Network; for Data/Comm; Industrial Equip; 9.3A; SMD; Solder Term; Clamp-V 43V, Pack of 100
ASIN번호 B07QYR9LXN
상품상태 New   
상품구분 Industrial & Scientific / Industrial Electrical
브랜드 general-semiconductor-vishay
판매자 Theodore's
판매자위치 미확인
현지 판매 가격
$86.80
상품가격 상세보기
관련상품



상품특징
Make sure this fits by entering your model number.Clamping Voltage-38.9 VConfiguration-SingleCurrent, Leakage-1 ACurrent, Peak-10.3 ACurrent, Ratings-9.3 A
상품설명
Overview Features: Low Profile Package Ideal for Automated Placement Glass Passivated Chip Junction Available in Uni-Directional and Bi-Directional 400 W Peak Pulse Power Capability with a 10/1000 s Waveform, Repetitive Rate (Duty Cycle): 0.01% (300 W Above 78 V) Excellent Clamping Capability Very Fast Response Time Low Incremental Surge Resistance Meets MSL level 1, Per J-STD-020, LF Maximum Peak of 260 ?C Solder Dip 260 ?C, 40 s Component in Accordance to RoHS 2002/95/EC and WEEE 2002/96/EC Applications: Use in sensitive electronics protection against voltage transients induced by inductive load switching and lighting on ICs, MOSFET, signal lines of sensor units for consumer, computer, industrial, automotive and telecommunication.








상품특징
Make sure this fits by entering your model number.Clamping Voltage-38.9 VConfiguration-SingleCurrent, Leakage-1 ACurrent, Peak-10.3 ACurrent, Ratings-9.3 A
상품설명
Overview Features: Low Profile Package Ideal for Automated Placement Glass Passivated Chip Junction Available in Uni-Directional and Bi-Directional 400 W Peak Pulse Power Capability with a 10/1000 s Waveform, Repetitive Rate (Duty Cycle): 0.01% (300 W Above 78 V) Excellent Clamping Capability Very Fast Response Time Low Incremental Surge Resistance Meets MSL level 1, Per J-STD-020, LF Maximum Peak of 260 ?C Solder Dip 260 ?C, 40 s Component in Accordance to RoHS 2002/95/EC and WEEE 2002/96/EC Applications: Use in sensitive electronics protection against voltage transients induced by inductive load switching and lighting on ICs, MOSFET, signal lines of sensor units for consumer, computer, industrial, automotive and telecommunication.




2019-04-29 14:05:57