lecimo 100x 8 Pin SMD to DIP Adapter Board SSOP8 0.65/1.27mm DIP Pin PCB Board Conver
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Make sure this fits by entering your model number.Product name: SOP8 adapter plateThese circuit boards are 0.65 mm apart on both sides and 1.27 mm apart on the other side, which exceeds the standard DIP of 2.54 mm.With these microplates, SMD components can be modified and upgraded to DIP packages.The size of the B-sided pin is 0.65 mm and can be used for most epoxy resins (EP), SSOP, TSSOP and MSOP with 2.54 mm DIP (EP).You can also use these adapters for prototyping by making SMD packages compatible with seamless mount cards. Any problems please feel free to contact us!
상품설명
Description: Number of layers Insulation thickness Flame retardant properties VO board Processing technology Reinforced material These PCB splitter boards have a pitch of 0.65mm on both sides and a 1.27mm pitch on the other side, breaking the standard 2.54mm DIP. These microplates can be used to modify and upgrade SMD components to DIP packages. You can also use these adapters for prototyping by making SMD packages compatible with solderless breadboards. The pin pitch is 1.27mm and can be used for most SO, SOP, SOIC to 2.54mm DIP. B side pin pitch size is 0.65mm, can be used for most SSOP, TSSOP, MSOP to 2.54mm DIP insulating resin epoxy (EP) Specifications: Material: Circuit Board Substrate: Copper Insulation: Organic Resin Color: Blue Size: 12*12mm Mechanical rigidity: rigidity Package Included: 100 * SSOP8 Patch To Inline Note: Please be reminded that due to lighting effects and monitor's brightness/contrast settings etc, the color tone of the website's photo and the actual item could be slightly different.
Make sure this fits by entering your model number.Product name: SOP8 adapter plateThese circuit boards are 0.65 mm apart on both sides and 1.27 mm apart on the other side, which exceeds the standard DIP of 2.54 mm.With these microplates, SMD components can be modified and upgraded to DIP packages.The size of the B-sided pin is 0.65 mm and can be used for most epoxy resins (EP), SSOP, TSSOP and MSOP with 2.54 mm DIP (EP).You can also use these adapters for prototyping by making SMD packages compatible with seamless mount cards. Any problems please feel free to contact us!
상품설명
Description: Number of layers Insulation thickness Flame retardant properties VO board Processing technology Reinforced material These PCB splitter boards have a pitch of 0.65mm on both sides and a 1.27mm pitch on the other side, breaking the standard 2.54mm DIP. These microplates can be used to modify and upgrade SMD components to DIP packages. You can also use these adapters for prototyping by making SMD packages compatible with solderless breadboards. The pin pitch is 1.27mm and can be used for most SO, SOP, SOIC to 2.54mm DIP. B side pin pitch size is 0.65mm, can be used for most SSOP, TSSOP, MSOP to 2.54mm DIP insulating resin epoxy (EP) Specifications: Material: Circuit Board Substrate: Copper Insulation: Organic Resin Color: Blue Size: 12*12mm Mechanical rigidity: rigidity Package Included: 100 * SSOP8 Patch To Inline Note: Please be reminded that due to lighting effects and monitor's brightness/contrast settings etc, the color tone of the website's photo and the actual item could be slightly different.
2020-06-29 16:44:18